Qualcomm’s upcoming Snapdragon 1000 SoC could be ready for HoloLens 2, Andromeda and even desktop PCs

Laurent Giret

A couple of weeks ago, a previous report from German blog WinFuture revealed that Qualcomm could be hard at work on a new Snapdragon 1000 SoC, a new chip designed for the ground up for future Windows 10 on ARM PCs. This new chip should be even more powerful than the upcoming Snapdragon 850, which Qualcomm officially unveiled at Computex earlier this month.

Winfuture’s Roland Quandt recently revealed even more information about the Snapdragon 1000, which according to his sources could be configured with up to 16GM of LPDDR4X RAM, two 128GB UFS flash drives. This new chip would also be pretty big with 20x15mm dimensions, and it could also be the first socketed ARM SoC to appear in the consumer space, contrasting with all the soldered chips we usually see on mobile devices.

The most important information that Quandt uncovered came from the LinkedIn profile of a Microsoft Windows Multimedia Project Engineer, which mentioned “test operations on Qualcomm Snapdragon premium tier chipset SDM845 and SDM1000 for desktop, Andromeda and HoloLens AR/VR/mixed reality products.” As you may know, Andromeda is the codename for Microsoft’s foldable mobile device.

Considering the rumored size of the Snapdragon 1000 SoC, we doubt that me may see it in Andromeda or HoloLens 2 (the latter may use Qualcomm’s new XR1 VR chip according to a recent report). However, this chip seem to be exactly what Microsoft and its OEM partners need to push Windows 10 on ARM PCs to the next level: that is, a chip that targets laptops and potentially desktop PCs, unlike the mobile-oriented Snapdragon 835 that was a bit underpowered for the first gen Windows 10 on ARM PCs.